Yini okufanele inakwe lapho ukhetha ibha yokukhanya ye-LED enhle

Okufanele kuqashelwe lapho kukhethwa ibha yokukhanya ye-LED enhle Imigqa yokukhanya ekhanyayo ye-LED esiyisebenzisayo manje inamandla kakhulu futhi ihlala isikhathi eside, futhi impilo yeshelufu evamile cishe iminyaka emi-3. Isisekelo sokuba namandla nokuqina ukuthi amasistimu ahambisanayo kanye nemininingwane kufanele ilandelwe ngokuqinile ngesikhathi sokukhiqiza. Okulandelayo kubala imichilo yokukhanya ekhanyayo ye-LED ngesikhathi sokukhiqiza. Izinto okufanele uzinake. 1. Naka i-anti-static, futhi kwenqatshelwe ngokuphelele ukuthinta ibhodi le-PCB ngaphandle kokuvikela okumile, okungase kubangele ukulimala kwe-LED ehlakazeka ubuhlalu besibani esibukisayo. 2. Qaphela ukuthi ungathinti ilensi ngaphandle kwamagilavu, okuzodala izigxivizo zeminwe kulens.

Ithinta imiphumela yokukhanya. 3. Qaphela ukuthi i-solder paste esetshenzisiwe isiphelelwe yisikhathi (imvamisa, i-solder paste ngemuva kokuvula idinga ukusetshenziswa kungakapheli amahora angama-24), futhi ikhwalithi ye-solder paste kufanele ibe yinhle. Kungale ndlela kuphela lapho impilo yesevisi yebha yokukhanya ekhanyayo ye-LED ingaqinisekiswa.

4. Naka i-glue yokuphulukisa, udinga ukuqinisekisa ukuthi ikhwalithi yeglue kufanele ibe yinhle. Kuyiglue ephilisayo ekwazi ukumelana nezinga lokushisa eliphezulu. Izinga lokushisa elijwayelekile lingama-70-90 degrees. Ngoba ubuhlalu besibani buzokhipha izinga lokushisa lapho busetshenziswa.

Uma i-glue yokuphulukisa ingakwazi ukumelana nokushisa okuphezulu, kuzobangela ukuba i-lens iwele. 5. Qaphela ukuthi ilensi yebha yokukhanya ekhanyayo ye-LED kufanele ibekwe endaweni, futhi ibanga phakathi kwelensi nebhodi le-PCB akufanele libe likhulu kuno-0.1mm. 6. Qaphela ukuthi ilensi yebha yokukhanya ekhanyayo ye-LED ayikwazi ukutshekiswa.

(I-engeli yokuthambekela ayikwazi ukudlula u-1°C) 7. Izinyathelo zokuqapha ekubekweni kwe-SMT, umshini wokubeka we-SMT kufanele ulungise idatha yobuhlalu besibani nezinto eziphikisayo. Akufanele kube khona i-skewing. 8. Qaphela ukuthi izinga lokushisa le-reflow soldering kufanele lilawulwe ngokunengqondo, ngaphandle kwalokho lizothinta ubuhlalu besibani se-LED.

9. Uma ukhipha iglue, kufanele ulawule inani leglue elikhishiwe. Ayikwazi ukweqa ingaphezulu lebhodi le-PCB lomugqa wokukhanya okhanyayo we-LED. 10. Qaphela ukuthi ukupakishwa kufanele kuphathwe ngaphansi kwemishini elwa ne-static.

Ngaphezu kwalokho, izikhwama ze-PE anti-static zisetshenziselwa ukupakisha bese zifakwa emakhathoni.